How to Choose Backing Plates for Sputtering Targets?
How to Choose Backing Plates for Sputtering Targets?
Sputtering represents a fundamental method for creating thin film materials. This technique harnesses ions produced by ion sources, which are then accelerated and focused in a vacuum to generate high-speed ion beams. These beams strike the solid surface, facilitating the exchange of kinetic energy with the atoms of the solid.
Upon impact, atoms detach from the solid and settle onto a substrate's surface, with the solid being bombarded referred to as the sputtering target.
Essential to the sputtering process is the backing plate, which provides crucial support for the sputtering target and secures it to the sputtering system. Additionally, the backing plate dissipates the heat produced during the process.
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Selecting the Appropriate Backing Plate Material
The most widely used backing plate materials are copper and stainless steel, both of which exhibit properties conducive to sputtering target applications. When selecting a backing plate material, it's crucial to ensure compatibility with the material used for the sputtering target.
Oxygen-Free Copper:
Renowned for its excellent electrical and thermal conductivity, oxygen-free copper is easy to fabricate. With proper care, it can be reused multiple times, often exceeding ten uses.
Stainless Steel:
Stainless steel tubes are commonly used as backing plates for rotary targets due to their favorable strength and thermal conductivity, making them a cost-effective choice.
There are alternative materials for backing plates, albeit less frequently used, including molybdenum, tungsten, and graphite.
Molybdenum:
Molybdenum boasts a high melting point and excellent corrosion resistance, suitable for high-temperature applications.
Tungsten:
Like molybdenum, tungsten is corrosion-resistant and has a high melting point, but it is considerably denser than most other backing plate materials. Graphite is lightweight and has commendable thermal conductivity but can be challenging to work with.
If you have inquiries about backing plate materials or require assistance in selecting the most suitable material for your needs, please reach out. We are eager to assist you in finding the right material for your application.
Key Considerations When Choosing Backing Plates
There are several critical aspects to consider when selecting a backing plate for a sputtering target.
1. The backing plate must ensure strong adherence to the target while maintaining effective electrical contact.
2. It is vital that the backing plate possesses excellent thermal conductivity to effectively dissipate the heat generated during sputtering, ensuring both the target and assembly remain cool.
3. Additionally, one should consider the mechanical durability of the backing plate; it needs to have sufficient strength to support the target's weight and endure the stresses exerted during sputtering.
Remember, sputtering targets function best when utilized appropriately. Following the tips above will enable your targets to achieve optimal results across various applications!
Our Backing Plate Solutions
At AEM Deposition, we recognize the significance of sputtering in numerous manufacturing procedures. Therefore, we offer an extensive array of sputtering targets and OEM services tailored to meet your precise requirements. Our backing plates come in various materials and sizes, available for individual purchase or bundled with our sputtering targets.
Interested in exploring more about rotary sputtering targets? Contact us today for an expert consultation!
With our diverse product offerings and exceptional OEM services, we are confident in providing the most cost-effective total ownership solution for your sputtering operations.
If you seek top-notch products and services at competitive pricing, look no further than AEM Deposition Company. We are committed to surpassing your expectations. Reach out to us today to learn how we can facilitate your manufacturing process.
Comparing Rotary Sputtering Targets and Planar Sputtering Targets
Many ask why rotary sputtering targets might be preferred over planar sputtering targets. While transitioning to larger rotary targets and adopting new equipment may entail some upfront costs (especially if you're accustomed to planar systems), in high-volume applications, the benefits typically yield a lower total cost of ownership:
- Rotary sputtering targets usually possess more surface area relative to their length compared to planar targets.
- In rotary systems, the expansive target surface allows magnetron power to be distributed across a wider area, promoting cooler operation, reducing nodule formation, and minimizing the chances of arcing.
- Reduced nodule formation in rotary sputtering prolongs target operational durations.
- More material is typically available for sputtering within rotary targets, leading to increased runtimes.
- Utilization rates tend to be around 80% for rotary targets, compared to approximately 30% for planar ones, which significantly lowers scrap rates while extending runtimes.
- Rotary sputtering systems are ideally suited for continuous applications, substantially elevating throughput due to minimized downtime in chamber preparation.
- For high-volume operations, rotary targets are more cost-effective, providing a robust setup for prolonged runtimes with decreased defects and operational downtime.
- Meanwhile, planar targets remain invaluable for prototype projects or elemental research, particularly when substantial quantities of material are not necessary.
For those interested in further exploring sputtering targets, feel free to connect with our team.